![]() THERMAL MANAGEMENT SYSTEM
专利摘要:
A thermal management system (10), comprising a first steam housing (14) adapted to receive a fluid (22) that absorbs heat energy from a first heat source (12), and a housing (30) of a phase change material (PCM) thermally connected to the first steam casing (14), the casing (30) of phase change material being adapted to receive a phase change material (32) which absorbs thermal energy the first steam casing (14), the first steam casing (14) and the casing (30) of phase change material being integral. 公开号:FR3040778A1 申请号:FR1658282 申请日:2016-09-07 公开日:2017-03-10 发明作者:Brian Magann Rush;Naveenan Thiagarajan;Bock Hendrick Pieter Jacobus De 申请人:General Electric Co; IPC主号:
专利说明:
Thermal management system Heat sinks cool mechanical parts and electrical components by evacuating thermal energy. For example, modern electronic devices use all kinds of electrical components (eg chips) that generate large amounts of thermal energy during operation. In order to protect these electrical components against excessive heat, the electronic devices can be thermally coupled to a heat sink. Normally, a heat sink continuously discharges thermal energy from the electrical components and transfers it to the environment by convection, conduction and / or radiation. However, some of these components may operate under unstable cooling conditions. In other words, the ability of a heat sink to transfer heat energy into the environment by conduction, convection and / or radiation can be temporarily or constantly limited. Unfortunately, under these unstable cooling conditions, existing systems may not effectively cool a mechanical part or an electrical component. In a first embodiment, a thermal management system includes a first steam housing adapted to receive a fluid that absorbs heat energy from a first heat source. The thermal management system also includes a phase change material (PCM) housing, the phase change material housing being adapted to receive a phase change material that absorbs heat energy from the first steam housing. In another embodiment, a thermal management system includes a first steam housing configured to receive a fluid that absorbs heat energy from a first heat source. The first steam casing comprises a duct. The thermal management system also includes a first phase change material housing, the first phase change material housing being adapted to receive a phase change material that absorbs heat energy from the fluid. Finally, the duct is designed to thermally connect the first steam casing to the first casing of phase change material. In yet another embodiment, a method of transferring thermal energy from a source comprises absorbing heat energy from the heat source using a fluid in a steam pan and transferring the thermal energy present in the fluid to a phase change material present in a casing of phase change material. The invention will be better understood from the detailed study of some embodiments taken by way of nonlimiting examples and illustrated by the appended drawings in which: FIG. 1 is a partial cutaway view in perspective of an embodiment a thermal management system; FIG. 2 is a sectional view, along line 2-2 of FIG. 1, of one embodiment of a fin; FIG. 3 is a fragmentary perspective sectional view, along the line 3-3 of FIG. 1, of one embodiment of a vascular network thermal management system; FIG. 4 is a schematic view of one embodiment of a thermal management system; FIG. 5 is a schematic view of one embodiment of a thermal management system; FIG. 6 is a schematic view of one embodiment of a thermal management system; FIG. 7 is a broken perspective view of an embodiment of a thermal management system; FIG. 8 is a broken perspective view of an embodiment of a thermal management system; and FIG. 9 is a broken perspective view of an embodiment of a thermal management system. One or more specific embodiments will now be described. In order to provide a concise description of these embodiments, not all the details of a concrete embodiment are described in the specification. It should be emphasized that when developing any of these implementations, as in any design or design project, many implementation-specific decisions need to be made to achieve the specific objectives of the projects. designers, including compliance with system and trade requirements, which may vary from one implementation to another. Moreover, it must be emphasized that such a development work is likely to be complex and time-consuming, but that it would nonetheless be a common undertaking of design, manufacture and manufacture for those skilled in the art of the present invention. The present embodiments provide a thermal management system capable of discharging heat energy from a heat source under stable cooling conditions (eg normal heat transfer from the thermal management system to the heat management system). environment) as well as in unstable cooling conditions (eg interruptions of heat transfer to the environment, excessive heat energy production by a heat source). In some embodiments, the thermal management system includes, within a vapor casing, a fluid that absorbs heat energy from a heat source. To facilitate the transfer of heat to the environment, the steam casing may include ducts or fins that enhance heat transfer. In addition, the thermal management system may include a phase change material (PCM) housing filled with phase change material (PCM) in thermal connection with the steam casing. The thermal management system may use the phase change material to absorb and / or store thermal energy from the steam sump during stable and / or unstable cooling conditions. FIG. 1 is an exploded partial perspective view of an embodiment of a thermal management system 10 (for example a heat sink) capable of evacuating thermal energy from an electrical source and / or heat mechanics 12 (eg a circuit board assembly) under stable and unstable cooling conditions. For example, the thermal energy management system 10 can evacuate heat from a chip, an avionics equipment card, a motherboard, etc. In order to quickly remove heat energy from the heat source 12, the thermal energy management system 10 comprises a casing 14 of low heat resistance steam. As illustrated, the steam casing 14 comprises a first plate 16 and a second plate 18 which form a cavity 20. In some embodiments, the first and second plates 16, 18 may be manufactured to conform to the shape of a or more surface (s) of a mechanical or electrical source 12 of heat. A steam casing 14 which conforms to the shape of the mechanical or electrical source 12 of heat can enhance the heat transfer by greatly limiting the distance between the steam casing 14 and the heat source 12 (eg casing 14 of The vapor may be in direct or near contact with the heat source 12. In some embodiments, there may be multiple thermal management systems stacked on top of one another with a heat source. The heat sources 12 may have the same shape or different shapes and the thermal management systems 10 (eg, the steam casing 14) may follow these forms. In operation, the steam casing 14 conducts energy from the heat source 12 through the first or second plate 16, 18, according to the plate near the heat source 12. In some embodiments, the first and second plates 16, 18 may both be in contact with separate heat sources 12. As the first plate 16 and / or the second plate 18 absorbs (s) energy the first plate 16 and / or the second plate 18 transfers (s) the thermal energy to a fluid 22 (eg water, ammonia, etc.) present in the cavity 20. A As the fluid 22 absorbs the thermal energy, the fluid 22 passes from a liquid phase to a gas phase. In the vapor phase, the fluid 22 enters one or more passages 24 formed in a duct or fin 26. In certain embodiments, the casing 14 of steam may comprise one or more duct (s) or fin (s) ) 26 (eg 1, 5, 10, 15, 20, 25 or more), each duct or fin 26 having one or more passages 24 (eg 1, 2, 3, 4, 5 or more) who receive the fluid 22. During stable cooling conditions, a cooling fluid 28 (eg a gas and / or a liquid) circulates around the fins 26 and, by convection, removes thermal energy from the fins 26 to cool the fluid 22. As the coolant 28 expels thermal energy from the fins 26, the fluid 22 cools and condenses (i.e., passes from a vapor phase to a liquid phase). The liquid phase of the fluid 22 is recycled and returns, under the effect of gravity and / or by capillarity, into the cavity 20 where the fluid 22 again absorbs thermal energy from the first and / or second plate (s) 16, 18. In some situations, the flow of coolant 28 may cease (eg in case of fan failure) and / or heat source 12 may produce excess thermal energy which can not be transferred fast enough into the environment. These situations can be called unstable cooling conditions. In order to compensate for unstable cooling conditions, the thermal management system 10 includes a phase change material (PCM) 32 (eg paraffin, wax, hydrated salts, metals, fatty acids, etc. .) thermally communicating with the casing 14 of steam. In operation, the phase change material 32 is able to store thermal energy that the thermal energy management system 10 is temporarily unable to transfer to the environment. As illustrated, one or more of the fins 26 extend / extend into the phase change material housing 30 where the phase change material 32 surrounds the fins 26. Thus, the phase change material 32 is able to absorb thermal energy from the fins 26, which in turn cools the fluid 22. The thermal energy stored by the phase change material 32 can then be transferred to the environment from the outer surface 34 of the casing 30 of phase change material and / or fins 26 (eg during steady state cooling conditions). In this way, the phase change material 32 serves as an integrated safety for cooling the heat source 12 during unstable cooling conditions. In order to prevent the loss of phase change material 12 from the phase change material housing 30, the thermal management system 10 may be manufactured in one piece (eg in one piece) . In other words, the steam casing 14, the fins 26 and the casing 30 of phase change material can be integrally formed. For example, the thermal management system 10 may be manufactured using an additional manufacturing method (eg, selective laser sintering, direct metal laser sintering, selective laser melting). By being manufactured in one piece, the thermal management system 10 can prevent leakage of phase change material 32 without the use of gaskets or seals. In addition, forming in one piece the thermal management system 10 allows for a casing 14 of highly conductive steam that can be provided with any shape. Figure 2 is a sectional view along line 2-2 of Figure 1 of a duct or fin 26. In Figure 2, the duct or fin 26 is rectangular in shape. However, other embodiments may include ducts or fins 26 of a different shape (eg circular, square, irregular, aerodynamically shaped). As explained above, the duct or fin 26 comprises at least one passage 24 (eg a lumen, a cavity) which conveys the vapor phase of the fluid 22 to the casing 30 of phase change material. As the vapor phase of the fluid 22 progresses in the conduit or fin 26, it transfers heat energy to a cooling fluid which circulates around the conduit or fin 26 and / or by heat transfer with the phase change material 32. In one way or the other, the fluid 22 loses thermal energy and condenses in the liquid phase. In certain embodiments, the fluid 22 may change phase in an imbibition layer 50 which impregnates the liquid phase of the fluid 22 to return it to the casing 14 of steam. In order to prevent fluid loss 22 in the wicking layer 50, the conduit or fin 26 comprises a non-porous outer layer 52 which surrounds the imbibition or inner layer 50. In some embodiments, the layers inner and outer members 50, 52 may be of different materials (eg metals of different porosity). In other embodiments, the inner and outer layers 50, 52 may be made of the same material (eg a metal), the inner and outer layers 50, 52 not having the same porosity. FIG. 3 is a fragmentary perspective view in section, along sectional line 3-3 of FIG. 1, of an embodiment of a thermal management system 10 with a vascular network steam casing 14 (FIG. eg a network resembling a hairy scalp). As illustrated, the vascular network 50 comprises a plurality of ducts or passages 52 including diameter, length, orientation, etc. may vary throughout the housing 30 of phase change material. These conduits 52 are in fluid communication with the passages 24 present in the fins 26. In operation, the conduits 52 convey the fluid 22 from the fins 26 into the housing 30 of phase change material. As the fluid 22 progresses in the conduits 52, the fluid 22 exchanges thermal energy with the phase change material 32. In some embodiments, the vascular network 50 can enhance the heat transfer to the material to be achieved. phase change 32 by enlarging the contact surface with the phase change material 32. Figures 4, 5 and 6 are schematic views of the thermal management system 10 illustrating different configurations of the steam casing 14, the fins 26 and the casing 30 of phase change material. For example, in FIG. 4, the thermal management system 10 may be designed to connect a steam casing 14 and a heat source 12 while providing a thermal connection of the steam casing 14 with the casing 30 of the change material. In this configuration, the cooling fluid cools the fluid 22 as it passes through the fins 26. This configuration also facilitates the convective heat transfer between the steam casing 14 and the casing 30 of the casing. phase change material as the coolant 28 passes over a surface 56 of the vapor casing 14 and a surface 58 of the casing 30 of phase change material. In Figure 5, the thermal management system 10 directly connects the casing 30 of phase change material to the steam casing 14. In this way, the casing 30 of phase change material can absorb thermal energy directly from the casing 14 of steam. As illustrated, the fins 26 extend entirely into the housing 30 of phase change material to expose the fins 26 to the cooling fluid 28. In some embodiments, one or more of the fins 26 may / may not extend completely into the housing 30 of phase change material. In yet other embodiments, some of the fins 26 may extend further than others relative to a surface 60 of the phase change material housing 30, thereby providing additional surface area for heat transfer. with the coolant 28. In Figure 6, the thermal management system 10 has more than one casing 14 of value and more than one housing 30 of phase change material. For example, the thermal management system 10 may have two or more steam casings 14 connected to respective first and second sides 70, 72 of the heat source 12. Each of these steam casings 14 may comprise one or more fins 26 which extend from the casings 14 of steam. As explained above, the fins 26 facilitate the heat transfer by enlarging the contact surface with the coolant 28. In some embodiments, some or all of the fins 26 are connected to a housing 30 of change material. a phase that absorbs thermal energy from the fins 26 with the phase change material 32. As illustrated, the casings 30 of phase change material can be connected directly to the steam casing 14 and / or spaced from the casing 14 steam. In addition, in some embodiments, one or more of the fins 26 may be connected to more than one housing 30 of phase change material. FIG. 7 is a fragmentary perspective cut-away view of an embodiment of a thermal management system 10. The thermal management system 10 comprises a frame 86 (eg a frame, a structure) which allows the system thermal management means 10 for supporting multiple steam casings 14 and / or casings 30 of phase change material, which can cool multiple heat sources 12 (eg 1, 2, 3, 4, 5 or more) . In Figure 7, the frame 86 is triangular; however, in other embodiments, the frame 86 may have a cylindrical, square, rectangular or other multi-faceted shape, etc. As illustrated, frame 86 may also be used as a housing 30 of phase change material. In addition, the vapor casing 14 may comprise a vascular network 50 within the phase change material casing and may be surrounded by the phase change material 32, in a manner similar to the description of FIG. 3. As explained above, the vascular network 50 comprises a plurality of conduits or passages 52 which can enlarge the area of the vapor casing 14 and thereby increase the heat transfer with the phase change material 32. As illustrated, the thermal management system 10 may include steam housings 14 surrounding first and second sides / surfaces 70, 72 of the heat sources 12 (eg electronic boards) to enhance cooling. For example, the steam housings 14 may form cavities 88 (eg pockets, passageways, etc.) which receive a respective heat source 12. In some embodiments, the steam housings 14 may first and second cavities 90, 92 in fluid communication with passages 94, allowing the fluid 22 to flow between the first and second cavities 90, 92. However, in some embodiments, the first and second cavities 90, 92 can be part of separate steam casings 14 which can be mechanically connected to each other but without fluid communication between them. In order to enhance heat transfer from the heat source 12, each of the steam housings 14 may include surfaces (eg, surface 96) that conform to the shape of the heat source 12. For example, the heat source 12 may comprise components 98 (eg chips) that create first and / or second sides / unequal surfaces 70, 72. In this way, the surface 96 of the steam sump can include protrusions 100 which allow the steam housing 14 to conform to the shape of the heat source 12 while still allowing the heat source 12 to be inserted into a respective cape 88. By matching the shape of the source 12 of heat, the casing 14 of steam greatly limits the distance between the casing 14 of steam and the sides 70, 72 of the heat source 12, which therefore enhances the heat transfer from the source 12 of heat. Figure 8 is a cutaway partial view of an embodiment of a thermal management system 10. The thermal management system 10 includes a frame 86 (eg a frame, a structure) that allows the management system It is also possible to simultaneously cool multiple heat sources 12 (eg 1, 2, 3, 4, 5 or more). In some embodiments, the frame 86 may also be duplicated as a casing 30 of phase change material. However, instead of a vascular network 50, as shown in FIG. 7, the casing 30 of phase change material receives one or more fins 26 of the steam casings 14 in fluid communication with the cavities 92. thermal management system 10 may also comprise fins 26 which are connected to the cavities 90. In this configuration, some of the fins 26 directly exchange thermal energy with the phase change material 32, inter alia, with the surrounding environment the thermal management system 10. As explained above, the steam housings 14 may surround the first and second sides 70, 72 of the heat sources 12 (eg electronic boards) to enhance cooling. For example, the steam housings 14 may form cavities 88 (eg pockets, passageways, etc.) which receive a respective heat source 12. In some embodiments, the steam housings 14 may first and second cavities 90, 92 in fluid communication with passages 94. However, in some embodiments, the first and second cavities 90, 92 may be in separate vapor casings 14 without fluid communication therebetween. In any event, the first and / or second cavity (s) 90, 92 of the steam casings 14 may comprise fins 26 which enlarge the area available for the heat transfer. Figure 9 is a cutaway partial view of an embodiment of a thermal management system 10. The thermal management system 10 includes a frame 86 (eg a frame, a structure) that allows the management system It is also possible to simultaneously cool multiple heat sources 12 (eg 1, 2, 3, 4, 5 or more). However, instead of the steam housings 14 which extend on the first and second sides 70, 72 of the heat source 12, the thermal management system 10 may comprise a housing 30 of phase change material which covers the first one. or the second side 70, 72 of the source 12 of heat, and a casing 14 of steam covering the opposite side. As illustrated, the casing 30 of phase change material may receive a vascular network 50 of the vapor casing 14. The vascular network 50 comprises a plurality of conduits or passages 52 including the diameter, length, orientation, etc. may vary. Thus, the phase change material 32 can directly absorb heat energy from the heat source 12 by contact with the phase change material housing 30, as well as energy from the steam source 14. On the other hand, in order to increase the heat transfer from the heat source 12, the steam casing 14 may comprise one or more fins 26 which facilitate the convective heat transfer to the environment (e.g. cooling 28). Among the technical effects of the invention is a thermal management system capable of discharging energy from a heat source under stable and unstable cooling conditions. For example, during steady state conditions, the thermal energy management system can transfer thermal energy by convection, using fins, from a steam sump. Under unstable steady-state conditions such as an interruption in the flow of a cooling fluid or the generation of excess heat energy by a heat source, the thermal management system absorbs thermal energy with the phase change material stored in a casing of phase change material.
权利要求:
Claims (20) [1" id="c-fr-0001] A thermal management system (10), comprising: a first steam housing (14) adapted to receive a fluid (22) which absorbs heat energy from a first heat source (12); and a casing (30) of phase change material (PCM) thermally connected to the first vapor casing (14), the casing (30) of phase change material being adapted to receive a phase change material (32) which absorbs heat energy from the first steam casing (14); the first steam casing (14) and the casing (30) of phase change material being integral. [2" id="c-fr-0002] The system (10) of claim 1, wherein the first steam housing (14) comprises a fin or conduit (26) thermally connected to the housing (30) of phase change material, the fin or conduit (26) being adapted to recirculate the fluid (22) in the housing (30) of phase change material. [3" id="c-fr-0003] The system (10) of claim 1, wherein the first steam housing (14) comprises at least one surface (96) conforming to a shape of the first heat source (12). [4" id="c-fr-0004] The system (10) of claim 2, wherein the vane or conduit (26) allows convective heat transfer to a cooling fluid (22). [5" id="c-fr-0005] The system (10) of claim 2, wherein the vane or conduit (26) extends entirely into the casing (30) of phase change material. [6" id="c-fr-0006] The system (10) of claim 1, wherein the first steam housing (14) comprises a vascular network (50) in the housing (30) of phase change material. [7" id="c-fr-0007] The system (10) of claim 1, wherein the vascular network (50) comprises a plurality of conduits (52) of varying diameter, shape, or length. [8" id="c-fr-0008] The system (10) of claim 1, comprising a second steam casing (14) and a second casing (30) of phase change material, the second casing (14) of value and the second casing (30) of phase change material being superimposable to the first steam casing (14) and to the first casing (30) of phase change material. [9" id="c-fr-0009] The system (10) of claim 1 including a frame (86) that supports the first steam casing (14) and a second steam casing (14), the second vapor casing (14) being adapted to evacuate the thermal energy of a second source (12) of heat. [10" id="c-fr-0010] The system (10) of claim 1, wherein the first steam housing (14) comprises a cavity (88) adapted to receive the first heat source (12). [11" id="c-fr-0011] The system (10) of claim 1 including the phase change material (32). [12" id="c-fr-0012] A thermal management system (10), comprising: a first steam housing (14) adapted to receive a fluid (22) that absorbs heat energy from a first heat source (12), the first housing ( 14) comprising: a conduit (52); and a first housing (30) of phase change material, the first phase change material housing (30) being adapted to receive a phase change material (32) which absorbs heat energy from the fluid (22). ); the conduit (52) being adapted to thermally connect the first steam housing (14) to the first phase change material housing (30). [13" id="c-fr-0013] The system (10) of claim 12, wherein the first steam housing (14), the first phase change material housing (30) and the conduit (52) are integral. [14" id="c-fr-0014] The system (10) of claim 12, wherein the conduit (52) comprises a fin (26) or a vascular network (50). [15" id="c-fr-0015] The system (10) of claim 12 including a frame (86) adapted to support the first steam casing (14), the first casing (30) of phase change material and a second casing (14) of steam. . [16" id="c-fr-0016] The system (10) of claim 15, wherein the first steam casing (14) and the second steam casing (14) are adapted to be thermally bonded to the first casing (30) of phase change material. [17" id="c-fr-0017] The system (10) of claim 16, wherein the first steam housing (14) is adapted to be thermally connected to the first steam source (14) and the second steam housing (14) is adapted to be connected thermally at a second source (12) of heat. [18" id="c-fr-0018] 18. System (10) according to claim 12, comprising a second casing (14) of steam and a second casing (30) of phase change material, the first casing (14) of steam being in fluid communication with the first casing (30) of phase change material and the second steam housing (14) being in fluid communication with the second phase change material housing (30). [19" id="c-fr-0019] A method for transferring heat energy from a source (12) of heat, comprising: absorbing heat energy from the heat source (12) with a fluid (22) into a housing (14) steam; and transferring the thermal energy present in the fluid (22) to a phase change material (32) in a casing (30) of phase change material. [20" id="c-fr-0020] The method of claim 19 including circulating the fluid (22) in the housing (30) of phase change material with a fin (26) or a vascular network (50).
类似技术:
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同族专利:
公开号 | 公开日 FR3040778B1|2020-02-07| CA2940035A1|2017-03-09| US10386127B2|2019-08-20| GB201614907D0|2016-10-19| US20170067693A1|2017-03-09| GB2542696B|2019-03-27| GB2542696A|2017-03-29| BR102016019296A2|2017-03-14|
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法律状态:
2017-09-25| PLFP| Fee payment|Year of fee payment: 2 | 2018-08-22| PLFP| Fee payment|Year of fee payment: 3 | 2019-02-15| PLSC| Search report ready|Effective date: 20190215 | 2019-08-20| PLFP| Fee payment|Year of fee payment: 4 | 2021-06-11| ST| Notification of lapse|Effective date: 20210506 |
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申请号 | 申请日 | 专利标题 US14/848,860|US10386127B2|2015-09-09|2015-09-09|Thermal management system| US14848860|2015-09-09| 相关专利
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